9/29 Thursday sunny
I have finished two 8D report , one for Foxconn,, the defects is board surface scratched. I don’t know the root causation, So I asked FQC by telephone. They tell me the reason is scratched by knife when they exscind the packing. The backdrop is that this batch boards were rework board for missing drier in vacuum packing. At first need they add the drier and packing a new packing plastic . But they can’t packed it, so they exscind the packing and packing it again. But due to careless of operator, they scratched the boards when they exscind the packing.
Another 8D report is asustek, I felt that I have answered many report which the defects are same. The frequently defects are stained silver on line., Pad oxidation etc.
We have received a asustek’s complain for overdue D/C, My mistake is not investigate this case immediately. Today I look for the outgoing recorder for verify if we outgoing this overdue D/C, result is we have not send this overdue D/C, So we must mix the overdue D/C boards in good boards. So it’s need the FQC investigate the rood causation and give the correct action.
9/28 Wednesday Sunny
